Single crystal copper nanocrystallization and sintered with silver nanoparticles

Silver nano-particles (Ag NPs) Pastes has been attracted attention in recent years, and had achieved great success, such as sintered at low temperature and got high shear strength. However, few people pay attention to the substrate nanocrystallization, herein, with the method of wet etching, we got nanostructure substrate of single crystal copper. Following, measured the wetting angle (H2O) and sintered with Ag NPs. The nanostructure and sintered result were observed by Atomic Force Microscope (AFM), scanning electron microscope (SEM) and EDX respectively. The results show that the wetting angle of Cu nanostructure substrate become larger which caused by the higher surface energy of the nanostructure. Besides, at 250°C, the Cu substrate diffused into the silver layer, much lower than the traditional diffusion temperature, which also may be explained by the nano-effect. All the result show that the nanostructure substrate make contribution to the nano-joining.