基于不同基板的2.45 GHz微带天线设计

Peter Čech, A. Pietrikova
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引用次数: 2

摘要

本文介绍了在具有不同介电常数的不同基板(FR4层压板,杜邦公司的Green Tape™951 LTCC和罗杰斯公司的RT/duroid 6010LM)上插入馈电矩形微带天线的设计。所有的天线都是为2.45 GHz频段设计的,这是现代无线通信(WiFi或蓝牙)最常见的频段之一。对天线进行了仿真,并从天线小型化的角度实现了仿真结果。为了使天线小型化,采用了介电常数($\varepsilon_{r}$)较高的衬底,衬底厚度近似相同。利用CST Microwave Studio对天线进行设计和优化。通过模拟,我们发现随着varepsilon_{r}$的增加,天线面积会减小,但会损害- 10 dB带宽的减少。随着基材厚度的增加,有可能消除这个问题。通过这种方式,可以实现所需的小型化,同时保持在WiFi区域使用该天线的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of Microstrip Antennas for 2.45 GHz on Different Substrates
This paper present designs of inset feeding rectangular microstrip antennas on different substrates with different dielectric constants (FR4 laminate, Green Tape™ 951 LTCC from DuPont and RT/duroid 6010LM from Rogers Corporation). All of antennas were designed for 2.45 GHz frequency band that is one of the most common frequency band for modern wireless communication (WiFi or Bluetooth). Antennas were simulated and results were realized from antenna miniaturization point of view. For antenna miniaturization were used substrates with higher dielectric constant ($\varepsilon_{r}$) at approximately similar substrate thickness. CST Microwave Studio was used for design and optimization of antennas. As a result of our simulations, we find that with an increase of $\varepsilon_{r}$ the antenna area will be reduced but at the detriment of the reduction of the bandwidth at −10 dB. It is possible to eliminate this problem with the increase of the thickness of the substrate. In this way it is possible to achieve required miniaturization while maintaining the possibility of using this antenna in the WiFi area.
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