不测量力或位移而测量脆性微梁的强度

微纳电子与智能制造 Pub Date : 2006-04-24 DOI:10.1109/ESIME.2006.1643990

A. Hirshberg, D. Elata

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引用次数: 0

摘要

提出了一种新型的脆性微梁强度测试装置。这种测试装置不需要测量施加的力或变形。在这项工作中，理论分析解释了如何从断裂梁的剩余韧带长度推导出微梁的强度

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Measuring the Strength of Brittle Microbeams Without Measuring Forces or Displacements

A new test device for measuring strength of brittle microbeams was recently proposed. This test device requires no measurement of applied forces or of deformation. In this work, the theoretical analysis that explains how the strength of microbeams may be deduced from the length of the remaining ligament of broken beams is presented

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来源期刊

微纳电子与智能制造

自引率

0.00%

发文量

145