添加Te(VI)的硫酸盐电解质在不同温度下电沉积Mn涂层的力学性能

A. Sulcius, N. Žmuidzinavičienė, E. Griškonis, A. Jezerskaitė
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引用次数: 0

摘要

研究了电解液温度和阴极电流密度对镀层显微硬度和拉伸应力的影响。在20°C下,用低电流密度(2 a × dm -2)在含Te(VI)添加剂的酸性锰电解液中电沉积了大部分硬镀层。在较高的电流密度(15 a × dm -2)和较高的电解液温度(70℃)下电沉积相同硬度的Mn涂层,硬度与涂层的结构和成分密切相关。在电解初期,Te掺杂在Mn镀层中,改变了镀层的结构和形貌。这导致相对较厚的涂层(1-2 m m)的最大拉伸应力值
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mechanical properties of Mn coatings, electrodeposited from sulphate electrolyte with Te(VI) additive at different temperatures
The influence of electrolyte temperature and cathode current density on the microhardness and tensile stress of electrodeposited Mn coatings have been investigated. It has been determined that mostly hard coatings were electrodeposited from the acid manganese electrolyte with the Te(VI) additive at 20 ° C using a low current density (2 A × dm –2 ). Mn coatings of the same high hardness were electrodeposited using a higher current density (15 A × dm –2 ) and at a higher electrolyte temperature (70 ° C). S upposedly , the hardness is related to the structure and composition of coatings very closely. It has been assumed that Te incorporates in the Mn coatings during the initial stage of electrolysis and changes their structure and morphology. This leads to the maximum tensile stress values of the relatively thick coatings (1–2 m m). DOI: http://dx.doi.org/10.5755/j01.ct.62.4.3317
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