环氧基体系中纳米级和微级填料的化学计量学及影响

2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena Pub Date : 2011-10-16 DOI:10.1109/CEIDP.2011.6232656

V. Nguyen, A. Vaughan, P. Lewin, A. Krivda

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引用次数: 6

摘要

环氧树脂及其复合材料填充微尺寸填料已广泛应用于不同的电气应用。大量的研究也考虑了与纳米级填料相关的大界面面积对材料性能的影响，但很少关注具有化学计量比例的系统。本文研究了树脂化学计量学对环氧树脂体系及其填充不同尺寸二氧化硅颗粒的复合材料介电性能的影响，包括玻璃化转变温度、介电常数和击穿强度。

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Stoichiometry and effects of nano-sized and micro-sized fillers on an epoxy based system

Epoxy resin and its composites filled with micro-sized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.

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2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena

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