高稳定性超小型OCXO在宽温度范围内工作:使用内置烤箱的ASIC用于OCXO

2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF) Pub Date : 2020-07-01 DOI:10.1109/IFCS-ISAF41089.2020.9234922

K. Irie, Jun-ichi Arai, Manabu Ito, Toshiyuki Shinotsuka, Manabu Ishikawa, S. Wakamatsu

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引用次数: 0

摘要

本文介绍了一种高稳定性的超小型OCXO，可在宽温度范围内工作。ASIC意识到OCXO可以非常缩小，最高工作温度越来越高，因为它几乎具有所有功能，包括OCXO应该具有的内置烤箱。我们在- 40至+95°C的范围内实现了约+/ - 5 ppb，并在$7.0\times 5.0\text{mm}$尺寸的封装中获得了出色的温度斜率特性。

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High Stability Ultra-Miniature Size OCXO Operating within Wide Temperature Range: Using ASIC with Built-in Oven for OCXO

This paper describes a high stability ultra-miniature size OCXO operating within wide temperature range using a ASIC with a built-in oven for OCXO. The ASIC realized that the OCXO could be extremely downsized and the maximum operating temperature is getting higher because it has almost all functions including a built-in oven which OCXOs should have. We have achieved about +/−5 ppb in a range of −40 to +95 °C and obtained excellent temperature slope characteristics for $7.0\times 5.0\text{mm}$ size package.

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2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

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