超塑性材料等静力扩散键合动力学

John Pilling
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引用次数: 72

摘要

建立了一个模型来预测在应力等静力状态下扩散键合过程中达到完全界面接触所需的时间。研究表明,粘结主要是由于材料随时间(超)塑性流动进入待粘合的两个表面接触时产生的界面空隙。对于超塑性扩散键,温度和压力对键合动力学的影响很小。然而,表面粗糙度的绝对尺度的变化,通过表面张力的影响,对键合时间有实质性的影响。Ti6Al4V的测量和预测成键时间之间的差异表明,在成键过程中,表面长程波浪度的减少与短波长的粗糙度的关闭一样重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The kinetics of isostatic diffusion bonding in superplastic materials

A model has been developed to predict the time required to attain full interfacial contact during diffusion bonding under an isostatic state of stress. It has been shown that bonding occurs primarily as a result of time-dependent (super)plastic flow of material into the interfacial voids created when the two surfaces to be bonded are brought into contact. For diffusion bonding within the superplastic regime, temperature and pressure have little effect on the kinetics of bonding. However, variations in the absolute scale of the surface roughness, through the effect of surface tension, have a substantial effect on the bonding time. Discrepancies between the measured and predicted bonding times for Ti6Al4V suggest that the reduction of the long-range waviness of the surfaces plays as significant a part in the bonding process as does the closure of the short wavelength roughness.

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