高速铁路对新开发银行的电磁干扰研究

IF 2.5 3区计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electromagnetic Compatibility Pub Date : 2021-06-01 DOI:10.1109/TEMC.2020.3032133

Nan Lu, F. Zhu, Yingchun Xiao, Xin Li

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引用次数: 4

摘要

电气化高速铁路(HSR)通过无向信标(NDB)保护区域产生的电磁干扰是一个重要的问题，特别是当列车通过中性段(NS)时。本文基于多段传输线理论，在考虑复杂因素的基础上，给出了列车通过多段传输线时接触线中频电流和电磁发射的计算方法。对连续波的辐射特性进行了定量研究，并通过实际测量验证了其有效性。分析了高铁对NDB导航信号的影响，给出了高铁的保护距离。该方法为高铁环境电磁学研究提供了理论依据，为机场选址提供了指导。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The Research on EMI of High-Speed Railway to NDB

The electromagnetic interference caused by electrified high-speed railway (HSR) through the protection areas of nondirectional beacon (NDB) is an important issue, especially when the train passes through the neutral section (NS). In this article, based on the theory of multisection transmission line and considering complex factors, the calculation method of medium-frequency current and electromagnetic emission (EME) on the contact wire (CW) when the train passes through NS is given. The radiation properties of the CW were studied quantitatively and its validity was verified by practical measurement. Then, the influence of HSR on NDB navigation signal is analyzed, and the protection distance of NS is given. This method provides theoretical basis for EME of HSR and guidance for airport site selection.

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来源期刊

IEEE Transactions on Electromagnetic Compatibility 工程技术-电信学

CiteScore

4.80

自引率

19.00%

发文量

235

审稿时长

2.3 months

期刊介绍： IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.