声音的极端:人类世的生态声音艺术

IF 0.8 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Circuit World Pub Date : 2022-08-31 DOI:10.7202/1091901ar

Leah Barclay

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引用次数: 0

摘要

气候变化的灾难性影响、生物多样性的消失和全球生态系统的迅速恶化需要紧急关注和积极的政治行动。本文通过一系列旨在引起人们对不断变化的生态系统的关注和认识的生态声音项目，探讨了跨学科研究的主体。这些项目被构建为参与式声学生态学，并将该学科定位为一个社会参与、包容、可访问、跨学科的领域，激励社区在危机时期倾听和行动。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Sounding Extremes: Ecological Sound Art in the Anthropocene

The catastrophic impacts of climate change, vanishing biodiversity, and the rapid deterioration of our global ecosystems require urgent attention and aggressive political action. This article explores a body of interdisciplinary research through a series of ecological sound projects designed to draw attention and awareness to changing ecosystems. These projects are framed as participatory acoustic ecology and position the discipline as a socially engaged, inclusive, accessible, interdisciplinary field that inspires communities to listen and act during times of crisis.

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来源期刊

Circuit World 工程技术-材料科学：综合

CiteScore

2.60

自引率

0.00%

发文量

审稿时长

>12 weeks

期刊介绍： Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes. Circuit World covers a broad range of topics, including: • Circuit theory, design methodology, analysis and simulation • Digital, analog, microwave and optoelectronic integrated circuits • Semiconductors, passives, connectors and sensors • Electronic packaging of components, assemblies and products • PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes) • Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal) • Internet of Things (IoT).