无胶8插座SPARC T5系统的带宽和电源管理

V. Krishnaswamy, Dawei Huang, Sebastian Turullols, Jinuk Luke Shin
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引用次数: 5

摘要

多核和多线程设计的不断发展需要优化硬件和软件的集成,以解决高端系统设计中日益增加的带宽和电源管理挑战。下一代使用SPARC T5处理器的Oracle t系列系统解决了这些挑战。这些系统使用1跳无胶连接扩展到1到8个套接字。该处理器实现了16个8线程内核,一个8MB L3缓存,四个片上内存控制器和两个片上PCIE Gen 3接口[1]。8套接字系统包含前所未有的1024个线程,在任何t系列系统中提供最高的线程数。全配置的8插槽T5系统支持基于ddr3 -1066的内存带宽达到2.9TB/s以上,相干带宽达到2+TB/s, PCI Gen 3带宽达到256GB/s,可提供5+TB/s的吞吐量(图3.7.1)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bandwidth and power management of glueless 8-socket SPARC T5 system
Continuous advancement in multicore and multi-threaded design requires optimized integration of hardware and software to address increasing bandwidth and power management challenges for high-end system designs. The next generation Oracle T-series systems utilizing the SPARC T5 processor address these challenges. These systems scale from one to eight sockets using a 1-hop glueless connection. The processor implements 16 8-threaded cores, an 8MB L3 cache, four on-chip memory controllers and two on-chip PCIE Gen 3 interfaces [1]. The 8-socket system comprises an unprecedented 1024 threads to deliver the highest thread count ever in any T-series system. The fully configured 8-socket T5 system supports DDR3-1066-based memory bandwidth, which reaches over 2.9TB/s, coherence bandwidth of 2+TB/s and PCI Gen 3 bandwidth with 256GB/s to deliver 5+TB/s throughput (Fig. 3.7.1).
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