近红外激光封装高机械强度、高介电性石墨烯/聚氨酯复合材料

Shuwen Wu, Jinhui Li, Guoping Zhang, R. Sun, C. Wong
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引用次数: 2

摘要

本文研究了具有共价键和Diels-Alder (DA)化学特性的石墨烯/聚氨酯复合材料。其中,石墨烯被功能化为填料,增强了复合材料的力学性能,并进一步作为吸收红外激光并将其转化为热的介质,基于可逆DA化学修复复合材料。此外,采用单分散石墨烯作为高介电材料,提高复合材料的介电性能。因此,制备的石墨烯/聚氨酯复合材料具有优异的力学性能、良好的介电性能和超强的红外激光修复能力。这些结果表明,新型石墨烯/聚氨酯材料可作为智能元件和封装电子元件领域的候选材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High mechanical strength and high dielectric graphene/polyuthane composites healded by near infrared laser
In this work, graphene/polyurethane composites with characteristic of covalently bonding and Diels-Alder (DA) chemistry was developed. Thereinto, graphene was functionalized as filler to enhance mechanical properties and further used as medium for absorbing the power of infrared (IR) laser and transferring it to heat for repairing the composites based on the reversible DA chemistry. Besides, the monodisperse graphene was used as high dielectric material to improve the dielectric properties of the composites. Therefore, the as-prepared graphene/polyurethane composites possess excellent mechanical properties, good dielectric properties and super repairing ability by means of IR laser. All the results indicated that the novel graphene/polyurethane could be considered as the candidate for intelligent components and the areas of encapsulated electronic components.
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