Scalable E-Band Waveguide Array Antennas for 5G and Beyond

This paper presents an E-band array antenna design for wireless applications. Three different versions of the array are presented ranging from 20 dBi to 32 dBi directivity. The broadband design makes them suitable to operate on both E-band channels simultaneously. The antennas are extremely low profile with a total package thickness of 3.25 mm and their footprint is defined by the aperture size. These high-frequency array antennas are enabled by TeraSi's siliconbased fabrication technology, which supports high-performance RF system-in-package in large volumes and at a low cost. The designs presented here are easily scalable both in volume and operational frequency, making them highly suited to 5G and future 6G network applications.