铜电精炼中结核生长机理的研究

Journal of Mmij Pub Date : 2020-02-29 DOI:10.2473/journalofmmij.136.8

K. Adachi, Y. Nakai, S. Mitsuno, M. Miyamoto, A. Kitada, Kazuhiro Fukami, K. Murase

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引用次数: 2

摘要

采用实验和模拟相结合的方法研究了铜电精炼过程中结瘤的形成机理，重点研究了结瘤的生长高度。由于尖端处的高电流密度，结核高度随电解时间呈指数函数增加。因此，核的大小对结核的生长行为有很大的影响，并且存在导致电短路的阈值尺寸。由于在工业生产过程中得到的一些结核中含有阳极铸造过程中携带的脱模剂，因此脱模剂被认为是造成大结核的主要原因之一，需要去除脱模剂以提高目前的效率。

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The Mechanism of Nodular Growth in Copper Electrorefining

The mechanism of nodulation in copper electroreﬁ ning process was investigated by experimental method and simulation, in particular as for its growth in height. Due to the high current density at the tip, the nodule height increased as an exponential function of the time for electrolysis. Therefore, the growth behavior of nodules was strongly affected by the size of the nucleus and the existence of the threshold size to lead an electrical short circuit was suggested. Since some nodules obtained in the industrial process included mold releasing agent carried from anode-casting process, mold releasing agents are considered to be one of the main causes of the large nodule and need to be removed for the improvement in the current efﬁ ciency.

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Journal of Mmij

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