表征湿润状态的光学计量学

IF 1.4 4区 工程技术
Deming Meng, Yifei Wang, Hao Yang, Buyun Chen, Pan Hu, Boxiang Song, Yunxiang Wang, Zerui Liu, Tse-Hsien Ou, Ximing Zheng, Yichen Gong, Wei Wu
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引用次数: 2

摘要

超疏水表面的独特性质已经被广泛地引入到许多应用中,并在我们的日常生活中发挥着越来越重要的作用。然而,不同的润湿状态会导致不同的性质和性能,因此区分润湿状态是必要的。到目前为止,由于缺乏一种准确且无损的技术来实时测试润湿状态,这阻碍了超疏水现象的研究及其应用。虽然这已经引起了科学界的注意,但目前还没有成功的解决方案。在此,我们开发了一种基于表征超疏水表面透射光谱的无损原位光学技术,该技术能够区分不同的润湿状态,如Cassie-Baxter状态、混合润湿状态和Wenzel状态。利用时域有限差分法,可以模拟超疏水表面的场分布和透射谱。实验数据与仿真数据吻合较好。所有结果都证明了新光学技术表征润湿状态的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical metrology of characterizing wetting states
The unique properties of superhydrophobic surfaces have already been widely introduced into many applications and play a more and more important role in our daily life. However, different wetting states will lead to different properties and performances so that distinguishing the wetting states is essential. Until now, as it lacks an accurate and nondestructive technology to test the wetting states in real time, this prevents the study of superhydrophobic phenomena and their applications. Although this has already caught the attention of the scientific community, there is still no successful solution presented yet. Here, we develop a nondestructive in situ optical technology based on characterizing the transmission spectrum of the superhydrophobic surfaces, which is capable of distinguishing the different wetting states such as the Cassie–Baxter state, the mixed wetting state, and the Wenzel state. By using the finite-difference time-domain method, field distribution and transmission spectrum of the superhydrophobic surfaces can be simulated. The experimental data fit well with simulation data. All the results prove the feasibility of the new optical technology to characterize wetting states.
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来源期刊
Journal of Vacuum Science & Technology B
Journal of Vacuum Science & Technology B 工程技术-工程:电子与电气
自引率
14.30%
发文量
0
审稿时长
2.5 months
期刊介绍: Journal of Vacuum Science & Technology B emphasizes processing, measurement and phenomena associated with micrometer and nanometer structures and devices. Processing may include vacuum processing, plasma processing and microlithography among others, while measurement refers to a wide range of materials and device characterization methods for understanding the physics and chemistry of submicron and nanometer structures and devices.
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