深度学习和卷积网络

2015 IEEE Hot Chips 27 Symposium (HCS) Pub Date : 2015-08-01 DOI:10.1109/HOTCHIPS.2015.7477328

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引用次数: 47

摘要

本文由作者在会议上的演讲幻灯片组成。带回家的信息:深度学习正在实现新的应用浪潮;深度学习和卷积网络被广泛部署;我们需要嵌入式应用的硬件(和软件);但我们离制造真正的智能机器还有很长的路要走。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Deep learning & convolutional networks

This article consists of a collection of slides from the author's conference presentation. Take Home Messages: Deep Learning is enabling a new wave of applications; Deep Learning and Convolutional Nets are widely deployed; We need hardware (and software) for embedded applications; But we are still far from building truly intelligent machines.

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来源期刊

2015 IEEE Hot Chips 27 Symposium (HCS)

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