预蚀刻次数对自蚀刻胶粘剂疲劳强度的影响。

T. Takamizawa, W. Barkmeier, A. Tsujimoto, H. Endo, K. Tsuchiya, R. Erickson, M. Latta, M. Miyazaki
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引用次数: 18

摘要

目的采用剪切粘接强度(SBS)和剪切疲劳强度(SFS)试验,确定自蚀刻胶粘剂应用前磷酸预蚀刻次数对釉质粘接的影响。材料与方法使用两种单步自蚀刻通用粘合剂(Prime&Bond Elect和Scotchbond universal),一种常规单步自蚀刻粘合剂(G-ӕnial Bond)和一种常规两步自蚀刻粘合剂(OptiBond XTR)。SBS和SFS分别在应用粘合剂前用磷酸预蚀刻3、10或15 s获得,而不进行预蚀刻(0 s)作为对照。采用阶梯法以10 Hz频率测定5万次循环或直至故障发生的SFS。每个处理过的牙釉质表面的平均脱矿深度也用轮廓仪测量。结果对所有胶粘剂,预蚀刻组的SBS和SFS均显著高于未预蚀刻组。而预刻时间> 3 s组的SBS和SFS无显著差异。预蚀刻组脱矿深度明显高于未预蚀刻组,但预蚀刻时间大于3 s的各组脱矿深度差异不显著。结论应用自蚀刻胶前3秒磷酸预蚀刻可提高牙釉质粘接效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Pre-etching Times on Fatigue Strength of Self-etch Adhesives to Enamel.
PURPOSE To use shear bond strength (SBS) and shear fatigue strength (SFS) testing to determine the influence of phosphoric acid pre-etching times prior to application of self-etch adhesives on enamel bonding. MATERIALS AND METHODS Two single-step self-etch universal adhesives (Prime&Bond Elect and Scotchbond Universal), a conventional single-step self-etch adhesive (G-ӕnial Bond), and a conventional two-step self-etch adhesive (OptiBond XTR) were used. The SBS and SFS were obtained with phosphoric acid pre-etching for 3, 10, or 15 s prior to application of the adhesives, and without pre-etching (0 s) as a control. A staircase method was used to determine the SFS with 10 Hz frequency for 50,000 cycles or until failure occurred. The mean demineralization depth for each treated enamel surface was also measured using a profilometer. RESULTS For all the adhesives, the groups with pre-etching showed significantly higher SBS and SFS than groups without pre-etching. However, there was no significant difference in SBS and SFS among groups with > 3 s of preetching. In addition, although the groups with pre-etching showed significantly deeper demineralization depths than groups without pre-etching, there was no significant difference in depth among groups with > 3 s of pre-etching. CONCLUSION Three seconds of phosphoric acid pre-etching prior to application of self-etch adhesive can enhance enamel bonding effectiveness.
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