第21场概述:扩展硅及其应用:技术方向小组委员会

Jan Genoe, F. Gianesello, M. Nagata
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引用次数: 0

摘要

本次会议包括来自ISSCC 2018技术方向小组委员会的六篇论文。前两篇论文介绍了用于机器学习的混合信号处理的进展,第三篇论文描述了在14nm FinFET技术中首次实现的32GHz机械谐振器,第四篇论文回顾了10Gb/s Si Photonics收发器,目标是1Tb/s/mm2 die-to-die通信。第五篇论文描述了一种创新的传感器,用于检测加密核心上的激光故障注入攻击,以避免任何信息泄露;最后一篇论文提出了一种针对ESR应用的注入锁定VCO阵列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Session 21 overview: Extending silicon and its applications: Technology directions subcommittee
This session includes six papers from the Technology Directions subcommittee at ISSCC 2018. The first two papers present advances in mixed signal processing for machine learning, the third paper describe a 32GHz mechanical resonator achieved for the first time in 14nm FinFET technology, the fourth paper reviews a 10Gb/s Si Photonics transceiver targeting 1Tb/s/mm2 die-to-die communication, the fifth paper describes an innovative sensor to detect laser fault injection attack on a cryptographic core in order to avoid any information exposure and the final paper presents an injection-locked VCO array targeting ESR application.
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