电沉积不同Cu含量的Ni-Zn-Cu合金对低碳钢性能的改善

Q4 Engineering
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引用次数: 0

摘要

本文研究了铜浓度对Ni-Zn-Cu合金镀层相组织、形貌和力学性能的影响。采用电化学沉积法在低碳钢基体上制备了Ni-Zn-Cu三元合金。通过不同的Cu浓度制备了四种不同的浴液。在4.5 mT的恒定磁场下,以20 mAcm-2的恒定电流密度,pH为3,沉积20 min,使镀层光滑。对合金涂层的晶体结构、表面形貌、硬度和力学性能进行了表征。结果表明:所沉积合金的晶体结构均为面心立方结构。随着Cu浓度的增加,合金的晶格参数逐渐减小,合金的形貌由大结核变为小结核。通过沉积Ni-Zn-Cu合金可以改善基体的力学性能,从而使低碳钢在模具、建筑和交通运输等行业中得到更广泛的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improvement in Properties of Mild Steel by Electrodeposition of Ni-Zn-Cu Alloys at Different Cu Contents
In this study, the effect of copper concentration was investigated on phase structure, morphology, and mechanical properties of Ni-Zn-Cu alloys coating. Ternary Ni-Zn-Cu alloys were prepared and deposited on a mild steel substrate by electrochemical deposition method. Four different baths were prepared by varying Cu concentration. The deposition was carried out for 20 min with constant current density of 20 mAcm-2 with pH of 3 under constant magnetic field of 4.5 mT to make the coating smooth. Crystal structure, surface morphology, hardness and mechanical properties of investigated alloy coatings were characterized. The results showed that crystal structure of the all the deposited alloys is face centered cubic. The lattice parameter is decreasing and morphology of the alloys changes from large nodules to smaller nodules with the increase in Cu concentration. Mechanical properties of substrate are improved by deposition of Ni-Zn-Cu alloys and thus mild steel will become more applicable in tooling, construction and transportation industries.
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来源期刊
Journal of Electrical and Electronics Engineering
Journal of Electrical and Electronics Engineering Engineering-Electrical and Electronic Engineering
CiteScore
0.90
自引率
0.00%
发文量
0
审稿时长
16 weeks
期刊介绍: Journal of Electrical and Electronics Engineering is a scientific interdisciplinary, application-oriented publication that offer to the researchers and to the PhD students the possibility to disseminate their novel and original scientific and research contributions in the field of electrical and electronics engineering. The articles are reviewed by professionals and the selection of the papers is based only on the quality of their content and following the next criteria: the papers presents the research results of the authors, the papers / the content of the papers have not been submitted or published elsewhere, the paper must be written in English, as well as the fact that the papers should include in the reference list papers already published in recent years in the Journal of Electrical and Electronics Engineering that present similar research results. The topics and instructions for authors of this journal can be found to the appropiate sections.
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