发布求助
文献互助 智能选刊 最新文献

印刷电路板吸湿性检测技术

Q4 Engineering
Journal of Microelectronics and Electronic Packaging Pub Date : 2020-01-01 DOI:10.4071/imaps.1014123
J. Craven, Ariel Oldag, R. Dean
{"title":"印刷电路板吸湿性检测技术","authors":"J. Craven, Ariel Oldag, R. Dean","doi":"10.4071/imaps.1014123","DOIUrl":null,"url":null,"abstract":"Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, ...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"17 1","pages":"28-33"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Technique for Detecting Moisture Absorption in Printed Circuit Boards\",\"authors\":\"J. Craven, Ariel Oldag, R. Dean\",\"doi\":\"10.4071/imaps.1014123\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, ...\",\"PeriodicalId\":35312,\"journal\":{\"name\":\"Journal of Microelectronics and Electronic Packaging\",\"volume\":\"17 1\",\"pages\":\"28-33\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectronics and Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/imaps.1014123\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.1014123","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

摘要

大多数电路板在有可能暴露于水汽或液体形式的环境中工作。因为低成本的电路板很容易吸收水分，…
本文章由计算机程序翻译，如有差异，请以英文原文为准。
分享
查看原文 本刊更多论文
A Technique for Detecting Moisture Absorption in Printed Circuit Boards
Abstract Most circuit boards operate in environments that have the potential to be exposed to moisture, either in vapor or liquid form. Because low-cost circuit boards can readily absorb moisture, ...
求助全文
通过发布文献求助，成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信