半导体:材料、物理和器件

IF 1.3 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Active and Passive Electronic Components Pub Date : 2016-01-01 DOI:10.1155/2016/4523960

Jiangwei Liu, Hong Zhao, Jinlong Liu, A. Maréchal, Wei Wang

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引用次数: 0

摘要

1国家材料科学研究所功能材料研究中心，茨城市筑波纳米1-1，茨城市3050044 2武汉理工大学材料科学与工程系，武汉430073 3北京科技大学材料科学与工程学院，北京100083 4西安交通大学电子信息工程学院，陕西西安710049

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Semiconductors: Materials, Physics, and Devices

1Research Center for Functional Materials, National Institute for Materials Science, 1-1 Namiki, Tsukuba, Ibaraki 3050044, Japan 2Department of Materials Science and Engineering, Wuhan Institute of Technology, Wuhan 430073, China 3School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China 4School of Electronic and Information Engineering, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China

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来源期刊

Active and Passive Electronic Components ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

1.30

自引率

0.00%

发文量

审稿时长

13 weeks

期刊介绍： Active and Passive Electronic Components is an international journal devoted to the science and technology of all types of electronic components. The journal publishes experimental and theoretical papers on topics such as transistors, hybrid circuits, integrated circuits, MicroElectroMechanical Systems (MEMS), sensors, high frequency devices and circuits, power devices and circuits, non-volatile memory technologies such as ferroelectric and phase transition memories, and nano electronics devices and circuits.