氯化物电解液电沉积锌铁合金的研究

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY
J. Jensen, G. Critchlow, D. Gabe
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引用次数: 15

摘要

利用电化学极化技术、埃歇电子能谱(AES)、扫描电子显微镜(SEM)、能量色散x射线分析(EDXA)和计算机辅助脉冲电镀(CA PP)研究了氯化物基电解质中锌铁合金的电沉积。随着阴极电流密度的变化,电沉积机制从平衡共沉积转变为异常共沉积。锌-铁合金的成分范围从小于5wt -%到大于75wt -%的铁已经从单一的电解液中电沉积,使该系统非常适合生产成分调制合金(CMA)电沉积。氯化物含量、pH值和电解质的搅拌对阴极表面的反应有很强的影响,就像在电沉积过程中使用脉冲反转电流一样。根据上述观察结果,提出了电沉积机理的理论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Study on Zinc-Iron Alloy Electrodeposition from a Chloride Electrolyte
The electrodeposition of zinc-iron alloys from a chloride-based electrolyte has been studied using electrochemical polarisation techniques, Auger Electron Spectroscopy (AES), Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Analysis (EDXA) and Computer Assisted Pulse Plating (CA PP). A change in the electrodeposition mechanism from equilibrium codeposition to anomalous codeposition with a change in cathodic current density has been observed. Zn-Fe alloys with compositions ranging from less than 5 wt-% to more than 75 wt-% Fe have been electrodeposited from a single electrolyte, making this system ideal for production of compositional modulated alloy (CMA) electrodeposits. Chloride content, pH and agitation of the electrolyte have been observed to have a strong influence on the reaction at the cathode surface, just as the use of pulse reversal current during electrodeposition. A theory on the electrodeposition mechanism, accounting for the above observations, is presented.
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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