用射频等离子体增强CVD制备含氟烷基的透明拒水膜

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1998-01-01 DOI:10.1080/00202967.1998.11871194

A. Hozumi, H. Sekoguchi, N. Sugimoto, O. Takai

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引用次数: 2

摘要

摘要采用射频等离子体增强CVD技术在聚碳酸酯、玻璃和硅基体上制备了含氟烷基基的透明拒水膜。以氟烷基硅烷的蒸汽为原料。沉积过程中衬底温度约为50℃。所得薄膜具有良好的防水性。水滴的最大接触角为107度。所得到的接触角取决于- (CF2) - in - FAS分子的数量。用FTIR和XPS对膜的性能进行了表征。证实了膜表面存在CP3 -、- cf2 -和> cf -三个氟烷基官能团。该涂层提高了PC基板的透光率。这些薄膜还具有抗反射涂层的功能。

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Transparent Water-repellent Films Containing Fluoro-alkyl Functions by RF Plasma-enhanced CVD

SummaryTransparent water-repellent films containing fluoro-alkyl functions were prepared on polycarbonate, glass and Si substrates by rf plasma-enhanced CVD. The vapours of the fluoro-alkyl silanes were used as raw materials. The substrate temperature during deposition was around 50°C. The films obtained had good water repellency. The maximum contact angle for a water drop was 107 degrees. The contact angles obtained depended on the number of—(CF2)—in FAS molecules. FTIR and XPS were used to investigate the film properties. The existence of the fluoro-alkyl functions CP3—,—CF2—and >CF—was confirmed at the film surfaces. The transmittance of the PC substrate was improved by the coating. These films also have a function as anti-reflective coatings.

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.