旋转电极电沉积制备Ni-B非晶合金薄膜及其结构变化

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY
M. Onoda, K. Shimizu, Yukio Tateishi, Tohru Watanabe
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引用次数: 8

摘要

摘要采用旋转电极对Ni-B族合金进行了电沉积。研究了镀层条件变化引起的共沉积B量和氢含量的变化,以及由此引起的薄膜结构变化。与在静态浴中制备的膜相比,使用圆柱形旋转电极制备的膜含有更多的共沉积B。用旋转电极制备B含量超过25at %的Ni-B非晶合金时,热处理后的薄膜结构与热平衡图中金属间化合物Ni3B和Ni2B的结构相对应。虽然Ni-B合金薄膜的氢含量受电流密度的影响,但它们与共沉积B的量相关性最强。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation of Ni-B Amorphous Alloy Films by Electrodeposition Using a Rotating Electrode and Their Structural Changes
SummaryElectrodeposition of Ni-B group alloys was conducted using a rotary electrode. The changes in the amount of codeposited B and in the hydrogen content that arise from changes in plating conditions, and the resulting structural chnages in the films were examined The following results were obtained: 1. The films prepared using a cylindrical rotating electrode contain a larger amount of codeposited B compared to those prepared in a static bath.2. When the Ni-B amorphous alloy with a B content exceeding 25 at % is prepared using a rotary electrode, the film structure after heat treatment corresponds to the structures of the intermetallic compounds Ni3B and Ni2B in the thermal equilibrium diagram.3. Although the hydrogen content of Ni-B alloy films are influenced by the current density, they correlate most strongly with the amount of codeposited B.
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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