一种新型机架式伺服器热模拟器:设计、组装与实验验证

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Ghazal Mohsenian, C. H. Hoang, K. Nemati, H. Alissa, Mohammad I. Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, B. Sammakia
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引用次数: 1

摘要

调试数据中心(DC)的做法是必要的,以确认冷却系统符合信息技术设备(ITE)负载(设计容量)。在典型的DC中,存在不同类型的ITE,每种ITE都具有其物理特性。考虑到ITE之间的这些几何和内部差异,将实际ITE用作自模拟器是不可行的。因此,采用了一种称为负载组的独立设备。负载组创建一个虚拟热负载,用于分析、测试冷却基础设施并对其施加压力。可用的商业负载库无法准确复制服务器的气流模式和瞬态热特征,这些特征由热惯性、能量耗散、流阻和风扇系统行为决定。在这项研究中,设计并构建了一个名为服务器模拟器的新型服务器原型,该原型使用不同的组件作为服务器实体模型。服务器模拟器准确地捕捉了空气阻力、散热和实际服务器行为的功能。实验数据显示,与商业负载库相比,使用所设计的服务器模拟器,ITE被动和主动流量曲线提高了93%。此外,实验结果表明,实际ITE和设计的服务器模拟器之间的临界背压和自由输送点差异低于5%。此外,实验数据表明,与商业负载组相比,所开发的服务器模拟器将实际ITE热质量提高了27%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
The practice of commissioning Data Centers (DCs) is necessary to confirm the compliance of the cooling system to the Information Technology Equipment (ITE) load (design capacity). In a typical DC, there are different types of ITE, each having its physical characteristics. Considering these geometrical and internal differences among ITE, it is infeasible to use the actual ITE as a self-simulator. Hence, a separate device called load bank is employed for that purpose. Load banks create a dummy thermal load to analyze, test, and stress the cooling infrastructure. Available commercial load banks do not accurately replicate a server's airflow patterns and transient heat signatures which are governed by thermal inertia, energy dissipation, flow resistance, and fan system behavior. In this study, a novel prototype of the server called server simulator was designed and built with different components to be used as a server mockup. The server simulator accurately captured air resistance, heat dissipation, and the functionality of actual server behavior. Experimental data showed up to 93% improvement in ITE passive and active flow curves using the designed server simulator compared to the commercial load bank. Furthermore, the experimental results demonstrated a below 5% discrepancy on the critical back pressure and free delivery point between the actual ITE and the designed server simulator. In addition, experimental data indicated that the developed server simulator improved the actual ITE thermal mass by 27% compared to the commercial load bank.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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