CIE 2022特别部分亮点

IF 2.6 3区工程技术 Q2 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS

Journal of Computing and Information Science in Engineering Pub Date : 2023-03-17 DOI:10.1115/1.4062144

M. Mani, P. Witherell, C. Rizzi

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引用次数: 0

摘要

这个特别的部分包含了第42届美国机械工程师学会(ASME)计算机和信息工程(CIE)会议的六篇论文，该会议于2022年8月14日至17日在密苏里州圣路易斯举行，与国际设计工程技术会议(IDETC)一起举行。这些论文由高级建模与仿真(AMS)、计算机辅助产品与工艺开发(CAPPD)、系统工程、信息与知识管理(SEIKM)和虚拟环境与系统(VES)四个技术委员会根据会议论文评审结果提名，反映了这些技术领域的最新和相关进展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Special Section Highlights of CIE 2022

This special section contains a selection of six papers from the 42nd American Society of Mechanical Engineers (ASME) Computers and Information in Engineering (CIE) Conference that was held in St. Louis, Missouri August 14-17, 2022, in conjunction with the International Design Engineering Technical Conferences (IDETC). Nominated by the four technical committees namely Advanced Modeling and Simulation (AMS), Computer Aided Product and Process Development (CAPPD), Systems Engineering, Information and Knowledge Management (SEIKM), and Virtual Environments and Systems (VES) based on the conference paper review results, these papers reflect recent and relevant advancements in these technical areas.

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来源期刊

Journal of Computing and Information Science in Engineering 工程技术-工程：制造

CiteScore

6.30

自引率

12.90%

发文量

100

审稿时长

6 months

期刊介绍： The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications. Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping