陶瓷-玻璃复合材料的高压绝缘和介电性能

IF 2.2 4区材料科学 Q2 MATERIALS SCIENCE, CERAMICS

Journal of Asian Ceramic Societies Pub Date : 2022-09-20 DOI:10.1080/21870764.2022.2123522

Ming-Yueh Hsieh, Wen-Shiush Chen, Cheng-Hsing Hsu, Cheng-Hsuan Wu

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引用次数: 2

摘要

摘要本文揭示了含有不同浓度的微添加剂钠长石、钾长石、锂玻璃和锌玻璃的不同厚度环氧树脂样品的高压绝缘性能，即介电常数、耗散因子、击穿强度和电压。选择0.1 wt%的KAlSi3O8陶瓷粉末作为1mm环氧树脂复合材料中的填料，设计用于绝缘，以获得最高击穿强度36.6491kV/mm。之后，在35.4687kV/mm下加入5wt%的Li-Bi-B-O玻璃，在35.0432kV/mm下添加10wt%的Zn-Bi-B-O玻璃，在33.6504kV/mm下放入10wt%的NaAlSi3O8。在实际应用中，由于击穿强度降低，不建议厚度增加超过1mm。出于绝缘目的，建议采用多层薄结构。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High-voltage insulation and dielectric properties of ceramic-glass composites

ABSTRACT This paper reveals the high-voltage insulation properties – namely the dielectric constant, dissipation factor, breakdown strength, and voltage – of epoxy resin samples of various thicknesses containing the microadditives albite, potassium feldspar, lithium glass, and zinc glass in different concentrations. 0.1 wt% KAlSi3O8 ceramic powders as fillers in 1 mm epoxy composites designed for insulation is taken as the choice for highest breakdown strength 36.6491 kV/mm. After that, 5 wt% Li-Bi-B-O glass at 35.4687 kV/mm, 10 wt% Zn-Bi-B-O glass at 35.0432 kV/mm, and 10 wt% NaAlSi3O8 at 33.6504 kV/mm. The increase of thickness more than 1 mm is not recommended in the practical application due to the decrease of breakdown strength. Multi-layer thin structure is recommended for insulation purpose.

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来源期刊

Journal of Asian Ceramic Societies Materials Science-Ceramics and Composites

CiteScore

5.00

自引率

4.30%

发文量

审稿时长

10 weeks

期刊介绍： The Journal of Asian Ceramic Societies is an open access journal publishing papers documenting original research and reviews covering all aspects of science and technology of Ceramics, Glasses, Composites, and related materials. These papers include experimental and theoretical aspects emphasizing basic science, processing, microstructure, characteristics, and functionality of ceramic materials. The journal publishes high quality full papers, letters for rapid publication, and in-depth review articles. All papers are subjected to a fair peer-review process.