用于评估下一代智能城市基础设施设备封装热管理解决方案的瞬态传热模型的开发和验证

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2022-07-26 DOI:10.1115/1.4055094

Shuv Dey, Luis Diego Monge Jimenez, J. M. Brown, Y. Joshi

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引用次数: 2

摘要

户外数字显示器在智能城市应用中越来越受欢迎和普遍，最近为连接到建筑物、路灯或交通杆的户外通信设备提供了隐藏解决方案和集成点。鉴于为下一代5G蜂窝网络供电的能源需求更大，这些设备在开发和评估热管理解决方案方面带来了独特的困难。本研究使用CFD/HT数值模型开发并验证了极端条件瞬态（ECT）气候模型，以评估具有代表性的5G小电池设备的昼夜热响应。该模型针对佐治亚州亚特兰大的当地条件进行了为期两天的验证。ECT气候模型的热响应与佛罗里达州迈阿密、纽约市和亚利桑那州凤凰城三个真实案例研究地点一起呈现。

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Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Outdoor digital displays have become increasingly popular and common for smart city applications, and more recently provides a concealment solution and integration point for outdoor communications devices meant to be attached to buildings, streetlamps, or traffic poles. Given the larger energy requirements for powering next generation 5G cellular networks, these devices create unique difficulties in developing and evaluating thermal management solutions. The present study develops and validates the extreme condition transient (ECT) climate model using a CFD/HT numerical model, to evaluate diurnal thermal responses from a representative 5G small cell devices. The model is validated for local conditions present in Atlanta, GA for two unique days. The thermal response from the ECT climate model is presented alongside three real case study locations, Miami, FL, New York City, NY, and Phoenix, AZ.

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.