Jun Tian, Yucheng Teng, Ruining Li, Yijiang Zhou, Daxing Zhang, S. Liu, Song Xue, Kabin Lin, Meng Wang, G. Leng, Congsi Wang
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Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging
A method for modeling the interconnection and signal transmission performance of double bond ribbons with configuration variation has been proposed. Arc interval function parameterization has been used to define the geometry of bond ribbons. The coupling model was created using the equivalent circuit approach, taking into account the mutual coupling between two ribbons. The average relative error of return loss is 9.21%, and the average relative error of insertion loss is 0.23%. The accuracy of the model has been verified, and the envelope interval of the signal transmission performance considering the variation of the interconnection configuration has been calculated.
期刊介绍:
The IEEE Microwave and Wireless Components Letters (MWCL) publishes four-page papers (3 pages of text + up to 1 page of references) that focus on microwave theory, techniques and applications as they relate to components, devices, circuits, biological effects, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, medical and industrial activities. Microwave theory and techniques relates to electromagnetic waves in the frequency range of a few MHz and a THz; other spectral regions and wave types are included within the scope of the MWCL whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.