基板型敏化FBG温度传感器

IF 1.6 4区工程技术 Q3 INSTRUMENTS & INSTRUMENTATION

Sensor Review Pub Date : 2023-03-28 DOI:10.1108/sr-03-2022-0156

Li Hong, JingYuan Wang, Jianxian Cai, Yuntian Teng, Zhongchao Qiu

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引用次数: 0

摘要

目的针对光纤布拉格光栅(FBG)温度传感器在测量中普遍存在的灵敏度低的问题，提出了一种基板型封装敏化的光纤光栅温度传感器。对传感器的灵敏度进行了理论分析;采用热膨胀系数大的铝合金;利用ANSYS软件对传感器进行仿真分析和优化设计;基于仿真结果研制了真实传感器;在本研究中，建立了一个测试系统来测试所提出的传感器的性能。结果表明，封装FBG温度传感器在−20℃~ 40℃范围内的灵敏度为27.3 pm/°C，是裸FBG传感器的2.7倍，线性度可达0.99以上。实际意义通过这种结构的设计，大大提高了光纤光栅温度传感器的灵敏度。独创性/价值本研究创新性地提出了基板型敏化FBG温度传感器。采用单金属结构可以提高光纤光栅的温度灵敏度，采用压片结构可以减小结构应变的影响。研究结果为同类传感器的开发和进一步提高光纤光栅温度传感器的灵敏度提供了参考。

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Substrate-type sensitized FBG temperature sensor

Purpose In response to the common low sensitivity of fiber Bragg grating (FBG) temperature sensors in measurement, an FBG temperature sensor sensitized in a substrate-type package structure is proposed. Design/methodology/approach The sensitivity of sensors is analyzed theoretically; aluminum alloys with large coefficient of thermal expansion are used; the ANSYS software is used for simulation analysis and optimization design of sensors; real sensors are developed based on simulation results; in this study, a test system was built to test the performance of the proposed sensor. Findings The results suggested that the sensitivity of encapsulated FBG temperature sensor is 27.3 pm/°C in the range of −20 °C to 40 °C, which is 2.7 times that of bare FBG sensor, while the linearity is up to more than 0.99. Practical implications The sensitivity of FBG temperature sensor is greatly improved by the design of the structure. Originality/value This study innovatively proposes substrate-type sensitized FBG temperature sensor. The temperature sensitivity of fiber grating can be improved by single metal structure, and the effect of structural strain can be reduced by a tab structure. The study results provide a reference for the development of like sensors and the further improvement in the sensitivity of FBG temperature sensors.

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来源期刊

Sensor Review 工程技术-仪器仪表

CiteScore

3.40

自引率

6.20%

发文量

审稿时长

3.7 months

期刊介绍： Sensor Review publishes peer reviewed state-of-the-art articles and specially commissioned technology reviews. Each issue of this multidisciplinary journal includes high quality original content covering all aspects of sensors and their applications, and reflecting the most interesting and strategically important research and development activities from around the world. Because of this, readers can stay at the very forefront of high technology sensor developments. Emphasis is placed on detailed independent regular and review articles identifying the full range of sensors currently available for specific applications, as well as highlighting those areas of technology showing great potential for the future. The journal encourages authors to consider the practical and social implications of their articles. All articles undergo a rigorous double-blind peer review process which involves an initial assessment of suitability of an article for the journal followed by sending it to, at least two reviewers in the field if deemed suitable. Sensor Review’s coverage includes, but is not restricted to: Mechanical sensors – position, displacement, proximity, velocity, acceleration, vibration, force, torque, pressure, and flow sensors Electric and magnetic sensors – resistance, inductive, capacitive, piezoelectric, eddy-current, electromagnetic, photoelectric, and thermoelectric sensors Temperature sensors, infrared sensors, humidity sensors Optical, electro-optical and fibre-optic sensors and systems, photonic sensors Biosensors, wearable and implantable sensors and systems, immunosensors Gas and chemical sensors and systems, polymer sensors Acoustic and ultrasonic sensors Haptic sensors and devices Smart and intelligent sensors and systems Nanosensors, NEMS, MEMS, and BioMEMS Quantum sensors Sensor systems: sensor data fusion, signals, processing and interfacing, signal conditioning.