LTCC用掺钙Al2O3/ K2O3-B2O3-SiO2复合陶瓷的低温共烧及介电性能

Q4 Engineering
Zhe Song, J. Chu, Kun-Fu Huang, L. Norén, Zhenxiao Fu, Yun Liu
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引用次数: 0

摘要

采用固相反应法制备了掺杂CaCO3的Al2O3/ K2O3-B2O3-SiO2低温共烧陶瓷(LTCC)介电材料。研究了Al2O3/ K-B-Si硼硅酸盐的微观结构和介电性能,以及Ca掺杂的影响。在880°C烧结后,获得了掺Ca的Al2O3/KBSiO硼硅酸盐新材料体系,其介电常数ϵr < 8,介电损耗tan δ≤0.002,在很宽的频率和温度范围内具有优异的稳定性。最重要的是,初步结果还表明,新的介电复合材料与现有的LTCC工艺具有良好的兼容性,表明LTCC的实际应用具有相当大的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3–B2O3–SiO2 Composite Ceramics for LTCC Applications
Al2O3/K2O3–B2O3–SiO2 low temperature cofired ceramics (LTCC) dielectric materials doped with CaCO3 were prepared by using a solid-state reaction. The microstructure and dielectric properties of Al2O3/K–B–Si borosilicate, together with the effects of Ca doping, were investigated. A new material system candidate of Al2O3/KBSiO borosilicate doped by Ca was achieved after sintering at 880°C, which presents an optimized performance on dielectric properties with a permittivity ϵr < 8 and dielectric loss tan δ ≤ 0.002 and excellent stabilities across very broad frequency and temperature ranges. Most importantly, the initial results have also indicated that the new dielectric composite material is well compatible with the existing LTCC process, suggesting a considerable potential for practical LTCC applications.
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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