SiC陶瓷在二维预应力下的划痕

Q3 Engineering
Zhang Gaofeng, Yijiang Zeng, Wenbo Zhang
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引用次数: 1

摘要

建立了碳化硅(SiC)陶瓷在二维预应力作用下的应力场模型,研究了预应力值、法向载荷和切向载荷对三种主应力和最大剪应力的影响。通过破坏性检查技术和结合数字显微镜的渐进研磨技术来评估和表征划痕引起的损伤。声发射(AE)技术也被用于损伤的在线监测。结果表明,在给定的划痕载荷下,随着预应力值的增加,声发射信号的幅度减小,二维预应力划痕对SiC陶瓷表面/亚表面的损伤小于常规划痕。因此,可以相信二维预应力方法有助于减少脆性材料的加工损伤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Scratching of SiC ceramics at two dimensional pre-stressing
A stress field model was built to study the effects of pre-stressing value, normal and tangential load on the three principal stresses and maximum shear stress when the silicon carbide (SiC) ceramics were scratched under two dimensional pre-stressing, and the scratching tests of SiC ceramic were conducted by using a Rockwell diamond indenter at different pre-stress values and normal loads. Scratching induced damage was assessed and characterised via destructive inspection techniques and progressive lapping techniques combined with the digital microscope. Acoustic emission (AE) technology was also used for the online monitoring of the damage. The results showed that, for a given scratching load, the amplitude of AE signals was reduced as the pre-stress values increasing, and surface/subsurface damage of SiC ceramics induced by two dimensional pre-stress scratching was less than that by conventional scratching. So one can believe that the two dimensional pre-stress method can contribute to decreasing the machining damage of brittle materials.
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来源期刊
International Journal of Nanomanufacturing
International Journal of Nanomanufacturing Engineering-Industrial and Manufacturing Engineering
CiteScore
0.60
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