纳米复合聚合物胶粘剂:综述

IF 3.5 Q2 Materials Science

Reviews of Adhesion and Adhesives Pub Date : 2019-06-01 DOI:10.7569/RAA.2019.097306

S. Kenig, H. Dodiuk, G. Otorgust, S. Gomid

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引用次数: 8

摘要

随着纳米技术的发展，纳米复合胶粘剂与传统胶粘剂相比具有许多优点。此外，随着纳米粘土(nc)、碳纳米管(CNTs)、纳米二氧化硅(NS)、多面体低聚硅氧烷(POSS)、二硫化钨(WS2)富勒烯和纳米管以及石墨烯纳米颗粒(GNPs)等商用纳米材料的出现，为在纳米尺度范围内定制粘合剂开辟了新的潜在途径。本文将回顾和分析各种基于环氧树脂、聚氨酯、有机硅、聚酰亚胺和丙烯酸的纳米复合胶粘剂的独特断裂机制和由此产生的性能，包括:NCs、CNTs、NS、POSS、WS2和GNPs及其当前和潜在的应用。

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Nanocomposite Polymer Adhesives: A Critical Review

With recent developments in nanotechnology, nanocomposite adhesives offer numerous advantages compared to conventional adhesive materials. Moreover, with the emergence of commercial nanomaterials such as: Nanoclays (NCs), Carbon nanotubes (CNTs), Nanosilica (NS), Polyhedral oligomeric silsesquioxanes (POSS), Tungsten disulfide (WS2) Fullerenes and Nanotubes, and Graphene nanoparticles (GNPs), new potential routes have been opened to tailor adhesives in the nanoscale range. This update will review and analyze the unique fracture mechanisms and the resultant properties of various nanocomposite adhesives based on epoxies, polyurethanes, silicones, polyimides and acrylics containing: NCs, CNTs, NS, POSS, WS2 and GNPs and their current and potential applications.

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来源期刊

Reviews of Adhesion and Adhesives MATERIALS SCIENCE, MULTIDISCIPLINARY-

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期刊介绍： With the explosion of research activity and reports, the need for concise and critical reviews of topics of contemporary research interest is manifest. Reviews of Adhesion and Adhesives (RAA) provides in-depth, incisive, illuminating and thought-provoking reviews written by subject matter experts covering all aspects of adhesion science and adhesive technology. Each review will be imbued with the author’s experience so that the reader will be able to assimilate the research in the area discussed easily and will be able to apply it in practice.The journal has relevance to a myriad of industries including textiles, printing, coatings, aerospace, medical, nanotechnology, biotechnology, building and construction, and microelectronics. The topics to be covered include, but not limited to, basic and theoretical aspects of adhesion; modeling of adhesion phenomena; mecha¬nisms of adhesion; surface and interfacial analysis and characterization; unraveling of events at interfaces; characterization of interphases; adhesion of thin films and coatings; adhesion aspects in reinforced composites; formation, characterization and durability of adhesive joints; surface preparation methods; polymer surface modification; biological adhesion; particle adhesion; adhesion of metallized plastics; adhesion of diamond-like films; adhesion pro¬moters; contact angle, wettability· and adhesion; superhydrophobicity and superhydrophilicity. With regard to adhesives, RAA will include, but not limited to, green adhesives; novel and high-performance adhesives; and medical adhesive applications.