IEEE半导体制造学报

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2022-10-28 DOI:10.1109/TSM.2022.3214939

引用次数: 0

摘要

列出本刊的编辑委员会、理事会、现任工作人员、委员会成员和/或社团编辑。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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IEEE Transactions on Semiconductor Manufacturing Publication Information

Presents a listing of the editorial board, board of governors, current staff, committee members, and/or society editors for this issue of the publication.

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.