电热粘结:两周后正畸托槽的剪切粘结强度。

G J Ward, E Mizrahi, P E Cleaton-Jones
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引用次数: 8

摘要

电热粘接是基于通过低电压电流选择性地对正畸支架加热,从而加速粘接树脂的固化反应。本研究的目的是比较9种树脂(包括化学固化、光固化和玻璃离聚体类型)在电热和传统粘接后14天的剪切强度。平均剪切强度和粘结强度从顺序(电热粘合)的7.4 MPa到简明(控制)的15.4 MPa不等。电热粘接与常规粘接之间无统计学差异。所有树脂在14天内产生了足以用于临床正畸的粘结强度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrothermal bonding: shear bond strength of orthodontic brackets after two weeks.

Electrothermal bonding is based on acceleration of the setting reaction of a bonding: resin by the selective application of heat to the orthodontic bracket through the passage of a low voltage electric current. The purpose of this study was to compare the shear bond strength of nine resins comprising chemically-cured, light-cured, and glass ionomer types, 14 days after electrothermal and conventional bonding. Mean shear and bond strengths ranged from a low of 7.4 MPa for Sequence (electrothermally bonded) to a high of 15.4 MPa Concise (control). There was no statistically significant difference between the electrothermal and conventional bonding methods. All the resins produced bond strengths adequate for clinical orthodontics at 14 days.

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