Electroless deposition of copper nanoparticles integrates polydopamine coating on reverse osmosis membranes for efficient biofouling mitigation

In this study, highly antimicrobial CuNPs were integrated into a hydrophilic polydopamine (PDA) coating and immobilized on a RO TFC membrane via a mild and facile reduction approach to form a stable and durable dual-functional layer. Based on the XDLVO analysis, the introduction of PDA increased the membrane-foulant total interaction energy $\left(\Delta G_{\mathrm{mwf}}\right)$ to 14.13 mJ/m², resulting in improved anti-adhesive properties as demonstrated by a 37% decrease in BSA adsorption for the modified membranes. The well dispersed and high loadings of CuNPs induced by PDA conferred strong bacterial toxicity to the modified membranes, reducing the viability of E. coli by 76%. Furthermore, the presence of catechol groups on PDA favors the formation of covalent bond with CuNPs, thus prolonging the durability of the copper-based anti-biofouling membranes. The combination of PDA coating and CuNPs functionalization imparts the membrane with simultaneous anti-adhesive and anti-microbial properties, leading to a substantial reduction in biofouling propensity in dynamic biofouling experiments. Specifically, the flux decline due to biofouling observed for the modified membranes significantly decreased from 65% to 39%, and biofilm thickness and TOC biomass were 58%, and 55% lower, respectively. This study provides a facile and versatile strategy to construct high performance RO membranes with excellent anti-biofouling functionality.