银/石墨烯改性微结构光纤增强SPR传感的仿真与实验

IF 2.5 3区 物理与天体物理 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Ying Guo , Xinpeng Tian , Shuguang Li , Jianshe Li , Yuefeng Qi
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引用次数: 0

摘要

提出并演示了一种利用银/石墨烯复合薄膜的微结构光纤传感器。该传感器是通过在MSF上沉积一层纳米厚的银膜,然后使用液相法将石墨烯膜转移到银膜上来制造的。该传感器利用了MSF中包层模式的倏逝场效应,在复合薄膜的辅助下有效地增强了表面等离子体共振(SPR)效应,使得传感器灵敏度有了很大的提高。仿真结果表明,银/石墨烯双层结构对传感器的模场有很大影响,可以很好地应用于后续的折射率传感研究。实验结果表明,经石墨烯修饰后,镀银MSF传感器的灵敏度提高到2916.8 nm/RIU。该传感器在生物医学和环境监测方面具有潜在的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation and experiment of enhanced SPR sensing in silver/graphene-modified microstructured fiber
A microstructured fiber (MSF) sensor utilizing a silver/graphene composite film is proposed and demonstrated. The sensor is fabricated by depositing a nanometer-thick silver film on the MSF and subsequently transferring a graphene film to the silver film using the liquid phase method. The proposed sensor leverages the evanescent field effect of the cladding mode in the MSF, effectively enhancing the surface plasmon resonance (SPR) effect with the assistance of the composite film, which results in a great gain in sensor sensitivity. Simulation results show that the silver/graphene bilayer structure substantially influences the mode field of the sensor and can be well applied in subsequent refractive index sensing research. The experimental findings reveal that the sensitivity of the silver-coated MSF sensor increases to 2916.8 nm/RIU following modification with graphene. The proposed sensor has the potential for applications in biomedical and environmental monitoring.
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来源期刊
CiteScore
5.00
自引率
3.70%
发文量
77
审稿时长
62 days
期刊介绍: This journal establishes a dedicated channel for physicists, material scientists, chemists, engineers and computer scientists who are interested in photonics and nanostructures, and especially in research related to photonic crystals, photonic band gaps and metamaterials. The Journal sheds light on the latest developments in this growing field of science that will see the emergence of faster telecommunications and ultimately computers that use light instead of electrons to connect components.
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