5G认知无线电四端口MIMO Al₂O₃陶瓷集成可重构宽带传感通信介质天线

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-27 DOI:10.1109/TCPMT.2024.3507277

Jayant Kumar Rai;Pinku Ranjan;Rakesh Chowdhury;Mohd Haizal Jamaluddin

{"title":"5G认知无线电四端口MIMO Al₂O₃陶瓷集成可重构宽带传感通信介质天线","authors":"Jayant Kumar Rai;Pinku Ranjan;Rakesh Chowdhury;Mohd Haizal Jamaluddin","doi":"10.1109/TCPMT.2024.3507277","DOIUrl":null,"url":null,"abstract":"In this article, a ceramic Al2O3 material-based MIMO reconfigurable integrated wideband sensing and narrow-band communication dielectric antenna for 5G cognitive radio (CR) application is presented. The proposed CR is a hybrid structure in which the antenna radiator is designed with a alumina (Al2O3) dielectric resonator (DR). The proposed Al2O3 material-based CR is integrated with a reconfigurable wideband antenna and a reconfigurable versatile filter (RVF). The primary function of RVF is to assist in the interweave and underlay CR operations. The proposed antenna performs multipurpose functions including sensing (Mode-1), interweaving (Mode-2), and underlay (Mode-3) CR. It offers a wideband between 1.87 and 4.43 GHz in Mode-1. It offers a tunable narrowband in Mode-2 between 1.76 and 3.82 GHz. It offers tunable band rejection between 1.64 and 3.26 GHz in Mode-3.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"94-103"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio\",\"authors\":\"Jayant Kumar Rai;Pinku Ranjan;Rakesh Chowdhury;Mohd Haizal Jamaluddin\",\"doi\":\"10.1109/TCPMT.2024.3507277\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this article, a ceramic Al2O3 material-based MIMO reconfigurable integrated wideband sensing and narrow-band communication dielectric antenna for 5G cognitive radio (CR) application is presented. The proposed CR is a hybrid structure in which the antenna radiator is designed with a alumina (Al2O3) dielectric resonator (DR). The proposed Al2O3 material-based CR is integrated with a reconfigurable wideband antenna and a reconfigurable versatile filter (RVF). The primary function of RVF is to assist in the interweave and underlay CR operations. The proposed antenna performs multipurpose functions including sensing (Mode-1), interweaving (Mode-2), and underlay (Mode-3) CR. It offers a wideband between 1.87 and 4.43 GHz in Mode-1. It offers a tunable narrowband in Mode-2 between 1.76 and 3.82 GHz. It offers tunable band rejection between 1.64 and 3.26 GHz in Mode-3.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 1\",\"pages\":\"94-103\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-11-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10769486/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10769486/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

本文提出了一种用于5G认知无线电（CR）应用的基于陶瓷Al2O3材料的MIMO可重构集成宽带传感和窄带通信介质天线。所提出的CR是一种混合结构，其中天线散热器设计与氧化铝（Al2O3）介电谐振器（DR）。提出的基于Al2O3材料的CR集成了可重构宽带天线和可重构通用滤波器（RVF）。裂谷热的主要职能是协助协调和支持CR行动。该天线具有传感（Mode-1）、交织（Mode-2）和底层（Mode-3） CR的多用途功能，Mode-1提供1.87 ~ 4.43 GHz的宽带。它提供了一个可调谐的窄带模式2在1.76和3.82 GHz之间。它在模式3中提供1.64和3.26 GHz之间的可调频带抑制。

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Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio

In this article, a ceramic Al2O3 material-based MIMO reconfigurable integrated wideband sensing and narrow-band communication dielectric antenna for 5G cognitive radio (CR) application is presented. The proposed CR is a hybrid structure in which the antenna radiator is designed with a alumina (Al2O3) dielectric resonator (DR). The proposed Al2O3 material-based CR is integrated with a reconfigurable wideband antenna and a reconfigurable versatile filter (RVF). The primary function of RVF is to assist in the interweave and underlay CR operations. The proposed antenna performs multipurpose functions including sensing (Mode-1), interweaving (Mode-2), and underlay (Mode-3) CR. It offers a wideband between 1.87 and 4.43 GHz in Mode-1. It offers a tunable narrowband in Mode-2 between 1.76 and 3.82 GHz. It offers tunable band rejection between 1.64 and 3.26 GHz in Mode-3.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.