自包装喷墨印刷垂直集成射频协同设计带通滤波平衡器

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Joe Steele;Dimitra Psychogiou
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引用次数: 0

摘要

提出了一种新型的自封装射频协同设计带通滤波平衡器(bpf - b),以及一种利用垂直集成喷墨印刷多耦合传输线(TLs)的新型集成方案。此外,该手稿概述了其实现的全面设计方法,利用双材料喷墨打印工艺提供的设计自由,从而能够创建紧密耦合的垂直集成TLs。该概念已通过宽带(WB)和超宽带(UWB) BPF-B原型的制造和测试得到实验验证,该原型具有${f} _{0} = 5$ GHz,占地面积$0.019~\lambda _{g}^{2}$和$0.025~\lambda _{g}^{2}$, 3db分数带宽(FBWs)分别为24%和111%。对于WB和UWB设计,功率损耗、相位不平衡(PI)和幅度不平衡(AI)分别在4.4 ~ 7.4 dB和1.8 ~ 4.8 dB、$4^{\circ}~ 4^{\circ}$和$2^{\circ}~ 2^{\circ}$和$0.45~\pm ~0.45$ dB和$0.4~\pm ~0.4$ dB之间测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Self-Packaged Inkjet-Printed Vertically Integrated RF Co-Designed Bandpass Filtering Baluns
A new class of self-packaged RF co-designed bandpass filtering baluns (BPF-Bs) is proposed with alongside a novel integration scheme utilizing vertically integrated inkjet-printed multicoupled transmission lines (TLs). Furthermore, the manuscript outlines a comprehensive design methodology for their realization, exploiting the design freedom afforded by a two-material inkjet printing process, which enables the creation of tightly coupled vertically integrated TLs. The concept has been verified experimentally through the manufacturing and testing of wideband (WB) and ultrawideband (UWB) BPF-B prototypes, having ${f} _{0} = 5$ GHz, footprints of $0.019~\lambda _{g}^{2}$ and $0.025~\lambda _{g}^{2}$ , and 3 dB fractional bandwidths (FBWs) of 24% and 111%, respectively. For the WB and UWB designs, power loss, phase imbalance (PI), and amplitude imbalance (AI) were measured between 4.4 and 7.4 dB and 1.8–4.8 dB, $4^{\circ }~\pm ~4^{\circ }$ and $2^{\circ }~\pm ~2^{\circ }$ , and $0.45~\pm ~0.45$ dB and $0.4~\pm ~0.4$ dB, respectively.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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