通过掺杂可变金属 Co 增强 BiOCl 的光催化活性以及降解有机污染物的相关研究

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-13 DOI:10.1007/s10854-024-13833-5

Yongli Yin, He Kang, Haifeng Zhou, Peng Liang

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引用次数: 0

摘要

通过在 n 型 BiOCl 纳米片上原位掺杂金属 Co 纳米颗粒，构建了一种新型 BiOCl/Co 催化剂。通过调整光催化剂中金属 Co 的掺入比例，提高了新型催化剂对污染物的降解性能。优化后的 BiOCl/Co 对罗丹明 B（RhB）的光催化降解效率高达 95.5%。这可能归因于 BiOCl/Co 的等离子体共振（SPR）增强了可见光吸收能力，以及 BiOCl/Co 中载流子的有效界面分离和传输。在降解 RhB 的过程中，BiOCl/Co 表现出优异的矿化能力和再利用性能。此外，研究表明光生成的 h+、⋅OH 和⋅O2-是染料降解的主要反应物质。本文阐明了 BiOCl/Co 对 RhB 的光降解机理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Enhancement of photocatalytic activity of BiOCl by doping with variable metal Co and related studies on degradation of organic pollutants

A novel BiOCl/Co catalyst was constructed by in situ doping of metal Co nanoparticles on n-type BiOCl nanosheets. The percentage of metal Co incorporated in the photocatalysts was adjusted to improve the degradation performance of the new catalysts against pollutants. The optimized BiOCl/Co achieved up to 95.5% photocatalytic degradation efficiency of rhodamine B (RhB). This might be attributed to the enhanced visible light absorption ability of BiOCl/Co by plasmon resonance (SPR) as well as the effective interfacial separation and transport of carriers in BiOCl/Co. BiOCl/Co showed excellent mineralization capacity and reuse performance in the degradation of RhB. Furthermore, it was shown that photogenerated h⁺, ⋅OH and ⋅O₂⁻ were the major reactive substances for dye degradation. The photodegradation mechanism of RhB by BiOCl/Co was elucidated in this paper.

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.