摩擦磨损行为下高速电气连接器的电接触可靠性研究

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2024-09-24 DOI:10.1016/j.microrel.2024.115510

Xin Lei, Chenzefang Feng, Weishan Lv, Yuqi Zhou, Chuanguo Xiong, Yuhan Gao, Fulong Zhu

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引用次数: 0

摘要

烧蚀是电气连接器使用过程中常见的现象之一，通常会受到工作环境的影响，并对电气触点的寿命产生重大影响。在这项工作中，通过理论分析、有限元模拟和实验验证相结合的方法，研究了不同摩擦磨损条件对电气触头失效的影响。通过在不同环境下的实验，对机械和电气特性进行了相关分析。可以得出结论，电触点失效的主要原因是触点结构退化和表面涂层脱落。烧蚀周期的增加加剧了高速电气连接器的表面烧蚀磨损。除了增加涂层厚度外，频率和振幅的降低也会延迟电气连接器的失效。由于持续磨损，插拔力会逐渐减小。同时还解释了磨损过程中电气接触的失效机理。这为预测电连接器的寿命提供了理论指导。

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Electrical contact reliability investigation of high-speed electrical connectors under fretting wear behavior

Fretting is one of the common phenomena during the use of electrical connectors, which is usually affected by the working environment and has a significant impact on the electrical contact life. In this work, the influence of different fretting wear conditions on electrical contact failure is studied by combining theoretical analysis, finite element simulation and experimental verification. The mechanical and electrical properties are related through experiments in different environments. It can be concluded that the main causes of electrical contact failure are contact structure deterioration and surface coating loss. Increased fretting cycles aggravate the surface fretting wear of high-speed electrical connectors. The failure of electrical connectors can be delayed by a decrease in frequency and amplitude in addition to an increase in coating thickness. The insertion and withdrawal force gradually decreases due to continuous wear. The failure mechanism of electrical contact during wear is also explained. It provides theoretical guidance for predicting the life of electrical connectors.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.