具有铝装饰纳米森林的 MEMS 热电堆，可进行宽带紫外线探测

IF 4.1 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electron Device Letters Pub Date : 2024-09-02 DOI:10.1109/LED.2024.3453291

Yonglong Pu;Huabin Yang;Meng Shi;Qirui Zhang;Na Zhou;Chengjun Huang;Haiyang Mao

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引用次数: 0

摘要

本研究采用 CMOS 兼容工艺制造了一种集成了铝纳米粒子装饰纳米森林（Al@NFs）的微机电热电堆。由于 Al@NFs 带来的光捕获效应和局部表面等离子体共振效应，紫外线（UV）光能可被有效吸收并转化为热能。因此，该器件实现了宽紫外检测范围。与不含 Al@NFs 的原始热电堆相比，该器件的电压响应在 240-400 纳米波长范围内提高了 2.0 至 16.2 倍。有了这样的优越性，制备的器件就能在实际应用中进行紫外线检测，包括在紫外线辐射下鉴别不同防晒霜的质量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A MEMS Thermopile With Al Decorated Nanoforests Capable of Broadband UV Detection

This work presents a MEMS thermopile integrated with Al nanoparticle-decorated nanoforests (Al@NFs), fabricated using a CMOS compatible process. Due to the light trapping effect and the localized surface plasmon resonance effect introduced by the Al@NFs, ultraviolet (UV) optical energy can be effectively absorbed and converted into heat energy. As a result, a broad UV detection range of the device is achieved. Compared with the pristine thermopile without such Al@NFs, the voltage response of the device is improved by 2.0 to 16.2 times within a wavelength range of 240–400 nm. With such a superiority, the as-prepared device is capable of UV detection for practical applications, including the quality discrimination of different sunscreens under UV radiation.

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来源期刊

IEEE Electron Device Letters 工程技术-工程：电子与电气

CiteScore

8.20

自引率

10.20%

发文量

551

审稿时长

1.4 months

期刊介绍： IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.