使用印刷电子材料和工艺封装 SiC 功率模块

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-05 DOI:10.1109/tcpmt.2024.3453209

Riadh Al-Haidari, Dylan Richmond, Abdullah Obeidat, Mohammed Alhendi, El Mehdi Abbara, Udara S. Somarathna, Mark Poliks, Arun V. Gowda, Jeff Erlbaum, Han Xiong, Collin Hitchcock

引用次数: 0

摘要

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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SiC Power Module Packaging Using Printed Electronics Materials and Processes

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.