氨基磺酸钠单晶的热稳定性和 Hirshfeld 表面分析概述

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
N. Sarkar,  Kiran, N. Vijayan, Divyansh Joshi
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引用次数: 0

摘要

在此,我们介绍了通过缓慢蒸发溶液技术生长出针状单晶体氨基磺酸钠的过程。我们使用 X 射线衍射和傅立叶变换红外光谱仔细确认了所得到的晶体结构。热分析是材料的独特指纹,可提供用于识别和表征的独特特征。通过热重仪、差热分析和导数热重仪 (DTG) 评估了标题化合物的独特热反应和稳定性。热分析有助于研究材料的降解,这对于了解材料对环境的影响和生命周期非常重要。在这一分析框架中,DTG 曲线被巧妙地运用到线性绘图法中,以确定活化能。为了深入了解分子间的相互作用,我们使用 Crystal Explorer 软件进行了 Hirshfeld 表面计算。Hirshfeld 表面为分析和理解晶体结构中的分子间相互作用提供了一种可视化的定量方法。这种探索为了解材料固有的成键动力学提供了一个窗口。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Overview of analysis on thermal stability and Hirshfeld surface of sodium sulphamate single crystals

Overview of analysis on thermal stability and Hirshfeld surface of sodium sulphamate single crystals

Here, we describe the growth of a needle-shaped single crystal of sodium sulphamate through the slow evaporation solution technique. The resultant crystal structure was meticulously confirmed using X-ray diffraction and Fourier transform infrared spectroscopy. Thermal analysis serves as a unique fingerprint for materials, offering distinct characteristics for identification and characterization. The distinctive thermal responses and stability of the titled compound were evaluated through thermogravimetry, differential thermal analysis, and derivative thermogravimetry (DTG). Thermal analysis helps in studying the degradation of materials, which is important for understanding their environmental impact and lifecycle. DTG curves were adeptly employed within this analysis framework to determine activation energy using a linear plotting approach. For deeper insights into intermolecular interactions, Hirshfeld surface computations were carried out using the Crystal Explorer software. Hirshfeld surfaces provide a visual and quantitative way to analyse and understand intermolecular interactions within a crystal structure. This exploration provides a window into the material’s inherent bonding dynamics.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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