Wanrong Xu, Jin Luo, Weiwei Zhang, Tao Sun, Jun Sun, Jianjun Wang, Chuanxiang Qin, Lixing Dai
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引用次数: 0
摘要
蓬松气流传感器在非接触式传感领域具有独特优势,而应变传感器在接触式传感领域则更具优势。然而,传感器要同时检测气流和应变,并具有快速响应时间和高灵敏度,仍然是一项挑战。将应变传感与气流传感相结合,可以同时对接触式和非接触式刺激做出响应。在此,我们首次展示了一种基于碳纤维植绒聚氨酯基底的柔性气流和应变双响应传感器的简便方法。将气流和循环应变刺激有效地转化为电阻信号,可实现高灵敏度(157.5% s m-1)和快速响应时间(37 毫秒)的瞬时传感。此外,该传感器还能轻松检测到来自感知物体的微小应变(0.1%)和低速气流(0.117 m s-1)。凭借出色的传感性能,这些双响应传感器比气流响应传感器对声波更加敏感。特别是,它们能有效地区分探测到的物体发出的微弱信号。利用该传感器的优势,可望在可穿戴设备、工业流程、航空航天、医疗设备和智能家居系统中实现精确控制和监测。
Flexible airflow-strain dual response sensor with high sensitivity based on polyurethane conductive fiber flocked carbon fibers
Fluffy airflow sensors have unique advantages in the field of non-contact sensing, while strain sensors have more advantages in the field of contact sensing. However, it remains a challenge for a sensor to simultaneously detect both airflow and strain with fast response time and high sensitivity. Combining of strain sensing and airflow sensing allows for a simultaneous response to both contact and non-contact stimuli. Herein, we demonstrate for the first time a facile approach for creating flexible airflow and strain dual response sensors based on polyurethane substrate flocked with carbon fibers. The effective transduction of airflow and cyclic strain stimuli into the electrical resistance signals enables instantaneous sensing with an high sensitivity (157.5% s m− 1) and an fast response time (37 ms). Furthermore, the sensor can easily detect subtle strain (0.1%) and low velocity airflow (0.117 m s− 1) from the perceived object. With their outstanding sensing performance, these dual response sensors are more sensitive to sound waves than airflow response sensors. Particularly, they can effectively distinguish faint signals from detected objects. Taking the advantage of the sensor, precise control and monitoring in wearable device, industrial process, aerospace, medical equipment and intelligent home furnishing system are expected.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.