作为氯化溶剂蒸汽传感器的钙[4]间苯二酚旋转涂层薄膜

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Rifat Çapan, İnci Çapan, Frank Davis, Asim K. Ray
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引用次数: 0

摘要

使用两种不同的钙[4]间苯二酚材料制造了纺丝薄膜。测定了钙[4]间苯二酚和未涂层金层的 SPR 曲线。将钙并[4]间苯二酚薄膜暴露在有机蒸汽中会导致它们被吸附到薄膜中,同时薄膜厚度和折射率也会发生变化,从而引起 SPR 曲线的移动。将薄膜反复暴露在 20-40-60-80-100% 的饱和蒸汽中最多七个循环,可获得动力学曲线。氯仿、二氯甲烷、四氯化碳和三氯乙烯蒸汽均用于气体暴露,并获得了每种化合物的动力学曲线。讨论了薄膜性质和吸附特性的差异。结果表明,钙[4]间苯二酚对氯仿的吸附效果最好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Spin-coated films of calix[4]resorcinarenes as sensors for chlorinated solvent vapours

Spin-coated films of calix[4]resorcinarenes as sensors for chlorinated solvent vapours

Spin-coated films of calix[4]resorcinarenes as sensors for chlorinated solvent vapours

Spun thin films were fabricated using two different calix[4]resorcinarene materials. SPR curves of the calix[4]resorcinarenes along with an uncoated gold layer were determined. Exposure of the calix[4]resorcinarene films to organic vapours led to their adsorption into the thin film with concurrent changes in film thickness and refractive index which caused shifts in the SPR curves. Kinetic graphs were obtained as a result of the repeated exposure of the film to 20–40–60–80–100% of saturated vapour for up to seven cycles. Chloroform, dichloromethane, carbon tetrachloride and trichloroethylene vapours were all utilised for the gas exposures and kinetic curves obtained for each compound. Differences in the film nature and adsorption properties are discussed. Differences in vapour adsorption were noted, with the calix[4]resorcinarenes being most effective at binding chloroform.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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