涡轮叶片薄膜冷却混合损失模型的研究进展

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Chenfeng Wang , Guoqing Li , Ruofan Wang , Yunhong Ruan , Chenyang Kang , Xingen Lu
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引用次数: 0

摘要

回顾了涡轮损耗模型的发展,特别是膜冷却影响下的损耗模型。从早期仅有空气动力学分析的损耗模型到薄膜冷却损耗模型,通过一系列实验和数值模拟验证,总结了目前薄膜冷却损耗模型的应用情况,并暴露了目前薄膜冷却损耗模型的局限性。研究发现,虽然混合过程具有三维假设,但薄膜冷却损失模型的开发在实验应用中存在滞后性。损耗模型的可行性有待提高。研究人员收集并分析了一些采用针对性优化算法的最新模型。可以预见,新提出的薄膜冷却损耗模型将更贴近优化算法,具有更现实的假设和更详细的分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research progress of mixing loss model for film cooling on turbine blade

The development of turbine loss models, especially the loss models under the influence of film cooling were reviewed. From early loss models with only aerodynamic analysis to film cooling loss models, a series of experimental and numerical simulation validation, application of film cooling loss models at present were summarized and limitations of the current film cooling loss models were exposed. Development of film cooling loss models was found to have a delay in experimental application, though the mixing process had three-dimensional assumption. The feasibility of loss models needed to be improved. Some recent models with targeted optimization algorithms were gathered and analyzed. It can be predicted that the newly proposed film cooling loss model will be more closely related to optimization algorithms with more realistic assumptions and more detailed analyses. and will have more practical application value such as being able to be validated in experiments under extreme conditions.

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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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