三维打印周期性多孔超材料，实现宽频可调电磁屏蔽。

IF 26.6 1区材料科学 Q1 Engineering

Nano-Micro Letters Pub Date : 2024-09-03 DOI:10.1007/s40820-024-01502-5

Qinniu Lv, Zilin Peng, Haoran Pei, Xinxing Zhang, Yinghong Chen, Huarong Zhang, Xu Zhu, Shulong Wu

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引用次数: 0

摘要

新一代电子元件需要在电磁干扰屏蔽效率和开放式结构因素（如通风和散热）之间取得平衡。此外，实现多孔屏蔽罩在宽波长范围内的可调屏蔽更是一项挑战。在本研究中，利用精心制备的热塑性聚氨酯/碳纳米管复合材料，采用熔融沉积建模三维打印技术制造了新型周期性多孔柔性超材料。研究重点尤其放在孔隙几何形状、大小、位错配置和材料厚度的优化上，从而在结构参数和屏蔽性能之间建立了明确的相关性。实验和模拟结果都验证了六边形衍生蜂窝结构的屏蔽性能优于其他设计，并提出了失效屏蔽尺寸（Df ≈λ/8 - λ/5）和临界倾斜角（θf ≈43°-48°），可作为可调电磁屏蔽的新基准。此外，适当调节材料厚度可显著提高最大屏蔽能力（85 - 95 dB）和吸收系数 A（超过 0.83）。多孔屏蔽盒的最终创新设计还在较宽的频率范围（超过 2.4 GHz）内表现出良好的屏蔽效果，为个性化和多样化的屏蔽解决方案开辟了新的途径。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

3D Printing of Periodic Porous Metamaterials for Tunable Electromagnetic Shielding Across Broad Frequencies

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3D Printing of Periodic Porous Metamaterials for Tunable Electromagnetic Shielding Across Broad Frequencies

Highlights

The stable periodic porous shielding materials were prepared by combining the strategies of 3D printing and metamaterial design.
The relationship between porous material structure and electromagnetic interference shielding efficiency (EMI SE) effectiveness was deeply explored, revealing the important structural parameters for realizing tunable EMI SE property.
The optimized design of the periodic porous shielding box achieves effective EMI shielding in a wide wavelength range (over 2.4 GHz).

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来源期刊

Nano-Micro Letters NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

32.60

自引率

4.90%

发文量

981

审稿时长

1.1 months

期刊介绍： Nano-Micro Letters is a peer-reviewed, international, interdisciplinary, and open-access journal published under the SpringerOpen brand. Nano-Micro Letters focuses on the science, experiments, engineering, technologies, and applications of nano- or microscale structures and systems in various fields such as physics, chemistry, biology, material science, and pharmacy.It also explores the expanding interfaces between these fields. Nano-Micro Letters particularly emphasizes the bottom-up approach in the length scale from nano to micro. This approach is crucial for achieving industrial applications in nanotechnology, as it involves the assembly, modification, and control of nanostructures on a microscale.