新型晶片安装技术的晶片切割振动研究

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-07-29 DOI:10.1109/tsm.2024.3435338

Mohd Syahrin Amri, Ghazali Omar, Mohd Syafiq Mispan, Fuaida Harun, MNB. Othman, N.A. Ngatiman, Masrullizam Mat Ibrahim

引用次数: 0

摘要

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.