电沉积制备的多层结构 TiB2/Cu 复合涂层的微观结构和性能

IF 2.7 4区材料科学 Q3 ENGINEERING, CHEMICAL

Journal of Adhesion Science and Technology Pub Date : 2024-06-23 DOI:10.1080/01694243.2024.2367864

Jianping Xu, Kexin Zhang, Jing Chen, Jiajie Wang, Yinghe Ma

引用次数: 0

摘要

为了提高铜表面的硬度，降低其摩擦系数，并调整涂层的整体性能，一种具有多层结构的 TiB2/Cu 复合涂层被制备出来。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Microstructure and properties of TiB2/Cu composite coating with multi-layer structure prepared by electrodeposition

In order to improve the hardness of the copper surface, reduce its friction coefficient, and adjust the overall performance of the coating, a TiB2/Cu composite coating with multilayer structure was...

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来源期刊

Journal of Adhesion Science and Technology 工程技术-材料科学：综合

CiteScore

5.10

自引率

13.00%

发文量

136

审稿时长

4.1 months

期刊介绍： Journal of Adhesion Science and Technology ( JAST) provides a forum for the basic and applied aspects of adhesion, chemistry of adhesives, coatings and sealants, and structure-properties relationships in adhesive joints and deals with applications of adhesion principles in all areas of technology.