基于栅极电荷的 IGBT 集电极电流模型

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Li Guan , Peng Zeng , Xin Zhang , Qi Li , Yonghe Chen , Jianghui Zhai , Feng Zhang , Baozheng Yang , Xianwen Cui , Jian Ye , Shi Cheng
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引用次数: 0

摘要

本研究提出了基于栅极电荷的 IGBT 动态和静态集电极电流 (IC) 模型。栅极电荷可通过测量栅极镜像电路电容上的电压轻松获得,并主要使用从 IC-VGE 曲线获得的跨导。该模型不需要掺杂浓度、长度和厚度等器件结构参数,因此成本低且非常方便。首先,通过积分可变电容 CGE 和 CGC 在开通和关断瞬态过程中的电流得出栅极电荷,并研究出动态 IC 和 QG 之间的分析关系。其次,建立了静态集电极电流 IC,并通过对米勒电容高原期间的电流积分获得了栅极电荷。研究了温度对静态跨导的影响,并提高了静态电流模型的精度。最后,利用各种电压、温度和电流对模型的性能进行了优化。实验结果表明,所提出的模型在各种工作条件下的集电极电流误差均小于 5.6%,验证了所提出模型的准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The collector current model of the IGBT based on the gate charge

In this study, a dynamic and static collector current (IC) model of the IGBT based on the gate charge is proposed. The gate charge could be easily obtained by measuring the voltage across the gate mirror circuit capacitance, and the transconductance obtained from the IC–VGE curve is mainly used. This model does not need the device structure parameters such as doping concentration, length, and thickness, thus is low cost and highly convenient. First, the gate charge is derived by integrating the currents of the variable capacitors CGE and CGC during the turn-on and turn-off transients, and an analytical relationship between the dynamic IC and QG is researched. Second, a static collector current IC is established, and the gate charge is obtained through current integration during the period of the Miller capacitance plateau. The influence of the temperature on the static transconductance is studied, and the accuracy of the static current model is improved. Finally, the performance of the model is optimized with various voltages, temperatures, and currents. The experimental results reveal that the proposed model achieves a collector current error of less than 5.6 % under various operating conditions, which verifies the accuracy of the proposed model.

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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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